Circuito stampato doppiafaccia

Double-Sided

BASE MATERIAL

  • Low-Tg / Medium-Tg /
    High-Tg FR4
  • FR4 - CTI 600
  • CAF-resistant FR4
  • Halogen-Free FR4
  • Materials for RF and HSD applications (Rogers, Taconic, IS680, I-Tera)
  • CEM 1
  • CEM 3 / CEM 3 HTC

SURFACE TREATMENT

  • Passivation
  • Lead-Free H.A.L.
  • Chemical Sn
  • Chemical Ag
  • Chemical Au
  • Electrolytic Ni/Au
  • Graphite

SOLDER-MASK

  • Green
  • White
  • Black
  • Red
  • Blue

BASE LAMINATE THICKNESS

  • 0,10 mm - 3,20 mm

BASE COPPER THICKNESS

  • 0,017 mm - 0,140 mm

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